Applied Materials sells critical tools for chip manufacturing across logic, memory, and advanced packaging.
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Price
$417.40
1D change
-1.37%
Market cap
$331.25B
Sector
Technology
| Metric | AMAT |
|---|---|
| Price | $417.40 |
| 1D Change | -1.37% |
| Market Cap | $331.25B |
| Enterprise Value | $329.36B |
| Trailing P/E | 35.8 |
| Forward P/E | 22.6 |
| PEG Ratio | 0.83x |
| Price / Sales | 10.7 |
| EV / Revenue | 10.7 |
| Revenue Growth | 24.8% |
| Earnings Growth | 42.8% |
| Gross Margin | 49.4% |
| Operating Margin | 33.7% |
| Net Margin | 30.1% |
| ROE | 41.1% |
| Free Cash Flow | $3.08B |
| FCF Margin | 10.0% |
| Debt / Equity | 0.29x |
| Current Ratio | 2.42x |
| Dividend Yield | 0.51% |
| Next Earnings | Nov 12, 2026 |
| Quarterly Revenue | $9.12B |
| Revenue QoQ | +15.2% |
| Quarterly Net Income | $2.54B |
| Net Income QoQ | -9.6% |
AMAT thesis lens
Deposition and materials engineering tools
Why it could benefit
- Applied Materials sells critical tools for chip manufacturing across logic, memory, and advanced packaging.
- AI requires more complex process steps and more materials engineering per wafer.
- HBM and advanced packaging raise process intensity beyond front-end lithography.
Moat / edge
- Broadest equipment portfolio across deposition, etch-adjacent, implant, and process control.
- Deep installed base at leading chipmakers.
- Service revenue adds recurring support through cycles.
What to watch
- Leading-edge logic and memory tool demand.
- Advanced packaging growth contribution.
- China sales mix and export restrictions.
Key risks
- Wafer-fab equipment cycles remain volatile.
- Restrictions on China can pressure near-term revenue.