Research Portal

U.S.-listed market research with live data and structured thesis notes.

Side-by-side research view

Compare names across metrics and research quality

Use up to 4 U.S.-listed names from this dashboard to compare valuation, growth, cash flow, balance-sheet strength, and the curated investment case in one place.

1 stocks in current compare
4 max names side by side
25 shared metrics lined up

Build a compare set

Enter comma-separated tickers from the dashboard universe. Duplicate tickers are ignored automatically.

Clear
Silicon Stack Data Center Fabric AI Software Power + Grid Robotics
AMAT Silicon, IP & Semicap

Applied Materials

Deposition and materials engineering tools

Detail page

Applied Materials sells critical tools for chip manufacturing across logic, memory, and advanced packaging.

Price $525.70
1D change -0.75%
Market cap $417.38B
Sector Technology

Shared metric table

Live market metrics plus reported quarterly revenue and profit QoQ rows.

Green and red only apply where direction is meaningful. Quarterly revenue and profit cells inherit the sign of the reported QoQ change, which can swing sharply when the prior quarter included a one-time item.

On smaller screens, swipe this table horizontally to compare the full set.

Metric AMAT
Price $525.70
1D Change -0.75%
Market Cap $417.38B
Enterprise Value $419.56B
Trailing P/E 49.7
Forward P/E 31.4
PEG Ratio 1.34x
Price / Sales 14.4
EV / Revenue 14.5
Revenue Growth 11.4%
Earnings Growth 33.5%
Gross Margin 49.0%
Operating Margin 31.9%
Net Margin 29.3%
ROE 39.7%
Free Cash Flow $3.04B
FCF Margin 10.5%
Debt / Equity 0.30x
Current Ratio 2.51x
Dividend Yield 0.40%
Next Earnings Aug 13, 2026
Quarterly Revenue $7.91B
Revenue QoQ +12.8%
Quarterly Net Income $2.81B
Net Income QoQ +38.5%

AMAT thesis lens

Deposition and materials engineering tools

Why it could benefit

  • Applied Materials sells critical tools for chip manufacturing across logic, memory, and advanced packaging.
  • AI requires more complex process steps and more materials engineering per wafer.
  • HBM and advanced packaging raise process intensity beyond front-end lithography.

Moat / edge

  • Broadest equipment portfolio across deposition, etch-adjacent, implant, and process control.
  • Deep installed base at leading chipmakers.
  • Service revenue adds recurring support through cycles.

What to watch

  • Leading-edge logic and memory tool demand.
  • Advanced packaging growth contribution.
  • China sales mix and export restrictions.

Key risks

  • Wafer-fab equipment cycles remain volatile.
  • Restrictions on China can pressure near-term revenue.